Mitsubishi Electric Corporation announced the upcoming release of two innovative power semiconductor modules in its SLIMDIP series on April 15. The new additions, the Full SiC SLIMDIP (PSF15SG1G6) and the Hybrid SiC SLIMDIP (PSH15SG1G6), mark the company's first foray into silicon carbide (SiC) technology within this compact, terminal-optimized module line. Scheduled for sample shipment on April 22, 2025, these modules are specifically designed to enhance the performance and energy efficiency of room air conditioners and other home appliances, catering to both small and large capacity needs.

The core innovation lies in the incorporation of Mitsubishi Electric's newly developed silicon carbide metal-oxide-semiconductor field-effect transistor (SiC-MOSFET) chip into both SLIMDIP packages. This strategic integration of SiC technology yields significant advantages over conventional silicon (Si)-based reverse-conducting insulated-gate bipolar transistor (RC-IGBT) SLIMDIP modules. Notably, the new SiC modules demonstrate the capability to achieve higher output, making them suitable for larger capacity appliances.

Furthermore, the adoption of SiC technology leads to a substantial reduction in power loss, a critical factor in improving the energy efficiency of appliances. Compared to their Si-based counterparts, the Full SiC SLIMDIP achieves an impressive 79% reduction in power loss, while the Hybrid SiC SLIMDIP offers a significant 47% power loss reduction. These figures, based on Mitsubishi Electric's simulations under specific operating conditions, underscore the potential for substantial energy savings in household applications.

The introduction of these two new SiC-based modules expands the Mitsubishi Electric SLIMDIP series to include three distinct options for appliance inverter boards, alongside the existing Si-based RC-IGBT modules. This comprehensive lineup provides appliance manufacturers with a range of choices tailored to specific electrical capacity and performance requirements. Importantly, all three options are offered in the same compact package, simplifying the design and manufacturing process of inverter substrates. This common footprint allows for greater flexibility in product development and reduces the burden of redesigning inverter boards when transitioning between different performance tiers.

Mitsubishi Electric will showcase these cutting-edge SLIMDIP modules at the upcoming Power Conversion Intelligent Motion (PCIM) Expo & Conference 2025 in Nuremberg, Germany, from May 6 to 8.

The SLIMDIP series is known for its compact design and terminal optimization, contributing to the miniaturization and simplification of inverter systems in home appliances. By integrating advanced SiC technology, Mitsubishi Electric is further enhancing the value proposition of this series, offering higher performance and greater energy savings in a familiar and convenient package. This development is poised to contribute significantly to the creation of more energy-efficient and higher-performing home appliances in the market.