Tosoh Unveils Cost-Effective GaN Sputtering Target for Semiconductor Manufacturing

Tosoh Corporation has unveiled its development of a gallium nitride (GaN) sputtering target, a new product being manufactured at Tosoh Specialty Materials Corporation, a subsidiary based in Yamagata City, Japan. GaN, a thin film semiconductor material, is widely used in applications like LED lighting and compact rapid chargers due to its lower energy loss compared to other materials. GaN thin films are gaining traction in energy-efficient power semiconductors, especially for data centers, as well as in micro-LED technology for wearable displays.

Traditionally, GaN thin films for semiconductors are produced using a method called chemical vapor deposition (CVD), which requires costly equipment and materials. Tosoh's newly developed GaN sputtering target, however, employs the more affordable sputtering technique, which is expected to reduce production costs significantly.

The company leveraged its proprietary synthesis and sintering processes to create a high-purity GaN material that can produce thin films with crystallinity like those produced through CVD. This makes Tosoh’s GaN sputtering target a promising alternative in the semiconductor manufacturing process. The new target is currently being evaluated by device manufacturers and has attracted attention from academic researchers exploring its potential.

By shifting from the traditional CVD method to sputtering, Tosoh believes it can establish a new business line focused on sputtering targets, which could help expand its market share in high-growth sectors, particularly in energy-efficient technologies. The company views this shift as a strategic move that not only offers a cost-effective solution for semiconductor production but also supports sustainability efforts by reducing energy consumption and costs.

This innovation aligns with the growing demand for GaN-based components in industries such as data centers and consumer electronics, where the need for power-efficient solutions is becoming increasingly critical. Tosoh’s development of a cost-effective GaN sputtering target positions it to play a significant role in these expanding markets. By providing an alternative to CVD, Tosoh is not only contributing to the reduction of production costs but also enhancing the sustainability of the semiconductor manufacturing process, aligning with global trends toward more energy-efficient and cost-effective technologies.

In summary, Tosoh’s new GaN sputtering target represents a significant step forward in semiconductor production, offering a more affordable and energy-efficient method for manufacturing GaN thin films. With its high-purity material and competitive advantages over CVD methods, Tosoh is poised to strengthen its position in the growing semiconductor market, while supporting the broader shift toward more sustainable energy solutions.