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Dow and Carbice Join Forces to Innovate Thermal Interface Materials
Dow and Carbice Join Forces to Innovate Thermal Interface Materials

Dow and Carbice Join Forces to Innovate Thermal Interface Materials

  • 10-Oct-2024 3:00 PM
  • Journalist: Nicholas Seifield

Dow and Carbice Form Strategic Partnership to Launch Innovative Multi-Generational Thermal Interface Materials for High-Performance Electronics.

In a groundbreaking collaboration, Dow and Carbice, a leader in carbon nanotube (CNT) technology, have announced a pioneering partnership aimed at revolutionizing thermal interface materials (TIMs). This first-of-its-kind alliance will focus on developing a multi-generational product line tailored for high-performing electronics across various sectors, including mobility, industrial applications, consumer electronics, and semiconductors. The collaboration leverages Carbice's expertise in CNT technology alongside Dow's extensive materials science capabilities to address the growing demand for efficient thermal management solutions in advanced electronic systems. Together, they aim to set a new standard in TIM performance, reliability, and sustainability, enhancing the thermal efficiency of next-generation electronic devices.

The collaboration, announced this morning, merges Dow's extensive expertise in silicone materials with Carbice's patented carbon nanotube (CNT) technology to introduce groundbreaking thermal management products. This partnership aims to address the increasing need for reliability in the growing thermal interface market by providing innovative pad solutions specifically designed for e-mobility and various electronics applications.

“Unveiling this partnership at the show highlights Dow’s commitment to advancing the future of mobility through innovative material science. By harnessing our application expertise and collaborating with industry leaders like Carbice, we aim to enhance the performance and reliability of electric vehicles,” said Jon Penrice, President of Dow Mobility.

“By partnering with Carbice, we can better serve our customers by providing thermal management solutions that combine liquid silicones with solid pads. This collaboration offers unique advantages within the industry, and we are excited to work together to establish new benchmarks for performance and reliability in electronic applications.”

Silicones and carbon nanotubes (CNTs) each bring distinct thermal management benefits to the table, but together they create an even more powerful solution. The exceptional wetting capabilities and precise dispensing characteristics of Dow silicones, combined with the remarkable versatility and durability of Carbice CNTs, establish a highly effective interface contact. This innovative combination significantly lowers all modes of stress transfer, leading to enhanced thermal performance and reliability.

By reducing stress transfer, this partnership ensures that thermal interface materials can maintain their effectiveness in a variety of demanding environments, making them ideal for applications in e-mobility, consumer electronics, and industrial settings. This collaboration not only advances the capabilities of thermal management solutions but also enables devices to operate more efficiently and reliably, ultimately supporting the growing need for high-performance electronics in an increasingly competitive market.

“Whether dealing with an electric vehicle battery or a GPU in a mobile device, electronics must be capable of enduring a variety of complex operating conditions without the risk of overheating,” stated Baratunde Cola, CEO and Founder of Carbice. “Our collaboration with Dow enables us to merge our high-performance, user-friendly thermal interface solutions with their silicone technologies. This combination produces durable, customized, and cost-effective solutions that can be relied upon in any temperature or moisture level. This partnership represents a significant advancement in our mission to provide essential components for the world's most critical applications at scale, fostering a future where trustworthy solid pads serve as the foundation of every electronic cooling system.”

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